RI顶尖的在线型AOI解决方案，提供超高速五支相机镜头的组装电路板检测，具有可靠的缺陷检测功能，即使是最复杂的焊点以及组装缺陷皆能检出。TR7500 SIII搭载智能化软件和高性能硬体的强大组合，提供可靠且易于使用的AOI解决方案，更致力于集中在高精度的检测结果并将誤判降到最低，以帮助优化您的生产产量。• 高精度五支镜头的多相AOI• 智能编程的GUI与离线编辑功能• 智能化自动输送带系统可减少进出板时间• 检测可靠，高精度，低误判

Optical SystemImaging Method Dynamic ImagingTop Camera 4 MpixAngle Camera 1.3 Mpix or 6.5 Mpix (factory setting)Imaging Resolution 10 µm, 15 µm (factory setting)Lighting Multi-phase RGB+W LED3D Technology Single/Dual 3D laser sensorsMax. 3D Range 20 mm (with 3D Laser Sensor upgrade optional)Inspection PerformanceImaging Speed 4 Mpix@ 10 µm 2D: 60 cm²/sec4 Mpix@ 15 µm 2D: 120 cm²/secMotion Table & ControlX-Axis Control Ballscrew + AC-servo controllerY-Axis Control Ballscrew + AC-servo controllerZ-Axis Control N/AX-Y Axis Resolution 1 µmBoard HandlingMax PCB Size TR7500 SIII: 510 x 460 mmTR7500L SIII: 660 x 610 mmTR7500 SIII DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lanePCB Thickness 0.6-5 mmMax PCB Weight 3 kgTop Clearance 25 mm [48 mm optional]Bottom Clearance 40 mmEdge Clearance 3 mm [5 mm optional]Conveyor InlineHeight: 880 – 920 mm* SMEMA Compatible